Mainly due to their low weight, low cost and ease of assembly,\udthe adhesive bonds have emerged as a promising technology.\udHowever, the lack of adequate tools of design and control\udremain an obstacle to the use of the adhesives. In this work a\udcohesive interface model formulated within the framework of\uddamage mechanics is applied for the simulation of decohesion\udduring crack propagation tests. Considering the mechanical\udtests of aluminium/epoxy specimens, comparisons between\udexperimental and numerical results are presented.
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